Multi Chip on Board – inductive und capacitive micro sensors
Flip Chip on Glass – optical length measuring systems
Chip on Flex – weather sensors
3D Multi Chip on MID – sun sensors
Multi Chip & SMD on Ceramic – micro wave applications
MEMS assembly – optical micro sensors

• Die Bonder, Dispenser & AOI on one platform
  
• Positioning accuracy ±10 µm @ 3 sigma
  
• 3D micro assembly tilt angle > 90°
  
• Dispensing dot ±0,1 nl @ 6 sigma
  
• Volume dispensing and 3D dispensing path ±0,01 µl @ 6 sigma
  
• Setup time < 5 min
  
• Machine capability cmk > 2,0
  
• Availability > 97%

download data sheet (428 kb)

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Tel: +49 (0) 036259/300 0 | Fax: +49(0) 036259/300 29