Dam & Optical Fill - optical micro sensors
Flip Chip Underfill - hearing aid module
Micro encapsulation - rotary rate sensors and acceleration sensors
Fractional silicon encapsulation - pressure sensors
Nano-dispensing bio-matters - medical micro sensors
Conductive adhesive dispensing - 54 GHz microwave applications
Soldering paste dispensing - pitch 0,3 and type 0201
3D path dispensing - structuring cambered glass surface

• Positioning accuracy ±10 µm @ 3 sigma
  
• Dispensing dot ±0,1 nl @ 6 sigma
  
• Volume dispensing and 3D dispensing path ±0,01 µl @ 6 sigma
  
• Minimum path width for soldering paste < 200 µm
  
• Machine capability cmk > 2,0
  
• Availability > 97%
  

download data sheet (343 kb)

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